Temperature-compensated electronic apparatus

ABSTRACT

A temperature-controlled electronic apparatus, comprises: a circuit board; a plurality of electronic components, mounted on the circuit board in an arrangement to form at least one electronic circuit; a temperature sensor, configured to measure a temperature of the at least one electronic circuit; and a heat-generating component, configured to be controlled by a temperature control circuit, the temperature control circuit being configured to control an amount of heat generated by the heat-generating component in response to the temperature measured by the temperature sensor. The plurality of electronic components are arranged on the circuit board to lie on one of one or more paths, each path of the one or more paths being defined by a respective circle having a radius.

TECHNICAL FIELD OF THE INVENTION

The invention concerns a temperature-compensated electronic apparatus,which may form part of an RF detector for generating a DC level from aRF input signal. Such an RF detector is also provided, together with acontrol circuit for setting an amplitude of an RF potential forsupplying to an electronic amplifier in an analytical instrument usingthis RF detector. The analytical instrument may be a mass spectrometercomprising an ion optical device, such as a quadrupole mass filter.

BACKGROUND TO THE INVENTION

Techniques for converting an AC voltage to an equivalent DC voltagerepresenting the amplitude of the AC voltage are well-known in manyelectrical or electronic systems. In the field of ion processing andmass spectrometry, a Radio Frequency (RF) detector uses such techniquesto transform the RF voltage to a corresponding signal indicative of theamplitude of the RF voltage as a DC voltage, as part of a closed-loopcontrol circuit to maintain the amplitude of the RF voltage as constant.It will be understood that such a DC voltage is not strictly a DCvoltage of a constant amplitude over time. Rather, the DC voltage is asignal having a DC level that indicates the amplitude of the RF voltage,which can be constant over the time but also change gradually over thetime depending on the transformed RF voltage as an input.

The closed-loop control circuit may form part of an ion optical device,such as a quadrupole, an ion trap, collision cell or an ion opticallens. Variation in the amplitude of the RF potential may affect theelectric field to which the ions are subjected in the ion opticaldevice, causing undesirable effects such as inaccurate measurements andloss of ions.

The current-voltage (I-V) characteristics of the components used in ACto DC conversion will have a significant effect on the DC output level.In particular, active components often used for rectification havecurrent-voltage characteristics that vary non-linearly with respect totemperature. For example, the currently most used semiconductor materialis silicon doped with different other chemical elements and combined toform a PN-junction. This junction has a temperature dependency in thatthe relationship between the voltage across the junction and the currentthrough depends on the junction temperature.

Referring to FIG. 1, there is shown a known relationship between thecurrent through a diode (I_(D)) and the voltage across the diode (U_(D))and how this varies with respect to temperature. This relationship isshown in both graphical and mathematical forms. Every semiconductor hasan intrinsic ohmic part (generally around 15-30Ω for a diode) in itscurrent path, so some power loss will occur, even in normal operation. Aconsequence of this power loss is that the semiconductor PN-junction ormetal-semiconductor Schottky junction of the diode will increase intemperature. Thus, as shown in FIG. 1, such an effect is self-amplifyingand a stable condition will not be reached on its own. A diode generallyalso has a parasitic capacitance of no more than about 1 pF.

Referring next to FIG. 2, there is depicted a typical existing circuitof a RF detector for converting an input AC voltage signal 10 to acorresponding DC voltage 60 using a diode 20, together with a graphillustrating the relationship between the input voltage (U_(rf)) and thepower dissipated in the diode (P_(D)). Such a design is used, forexample, in the Inductively Coupled Plasma (ICP) mass spectrometermarketed by Thermo Fisher Scientific (TM) under the brand name “iCAP”,models “Q” and “RQ”. The RF detector is normally used in an electronicclosed-loop circuit, to hold the amplitude of the RF signal at adesired, constant level. The RF detector comprises: the diode 20; aresistor 30; a capacitor 40; and an inductor 50. The capacitor 40 andinductor 50 form a low pass filter, so that the DC output 60 has a lowripple. Due to the use of a semiconductor (the diode 20) as therectifying element, this configuration is temperature dependent. Therelationship between voltage and the power dissipated in the diode(which is closely linked to the diode temperature, T_(D)) is highlynonlinear. This results in the relationship between the amplitude of theAC input 10 and the DC voltage level 60 being nonlinear with respect totemperature as well.

Hence, temperature effects will cause a DC offset voltage error at theoutput 60 of the RF detector circuit. This DC offset voltage also has anonlinear relationship with respect to the incoming AC voltage 10,because a higher incoming voltage 10 will cause a higher current in thediode (and potentially other components), more power loss and thereforemore heat in the diode, changing its current-voltage characteristic.This is particularly a problem when high power inputs are provided, suchas for an RF potential to be provided to an ion optical device.

It is also known to maintain the circuit at a constant temperature byexternal temperature control, as considered in U.S. Pat. No. 2,221,703and U.S. Pat. No. 2,930,904, for instance. For example, a temperaturesensor may be used to detect the temperature and a heater may thenincrease the temperature if it is below a desired level, by closed-loopfeedback. The temperature is typically maintained at a temperaturehigher than room temperature thereby. The idea behind this approach isto eliminate heat-related error sources in the rectifying componentitself. By holding the temperature constant, the voltage from thedetector may be kept precise and stable over time, even with temperaturechanges.

With reference to FIG. 10, there is schematically shown an arrangementof components for an existing ambient temperature-compensated RFdetector circuit 500. The circuit 500 comprises: rectifying diodes 520;load resistors 530; a capacitor 540; an inductor 550; heating resistors560; a transistor 570; an operational amplifier 580; and passive controlcomponents 590. These are mounted on a printed circuit board (PCB). Inview of the electrical requirements, the components are typically laidout in a symmetrical fashion, indicated by symmetry line 501.

A temperature sensor 595 measures the temperature at a chosen point onthe PCB and an according amount of heat is provided to keep thetemperature stable. The rectifying diodes 520, load resistors 530,capacitor 540 and inductor 550 are the heated components 510 forming theRF detector (for instance as shown in FIG. 2). The transistor 570,located below the heated components 510 on the PCB, controls the currentthrough the heating resistors 560, which maintain the heat level. Thetransistor 570 is controlled by the operational amplifier 580 and itsassociated passive control components 590, to set the heating level.This closed-loop control circuit is located below the actuatingtransistor 570.

The heating resistors 560 convert the electrical power determined by thecurrent supplied to heat energy to heat the components 510, which theysurround. The transport of the heat is mainly realised by thermalconduction through the PCB material, which is typically made from an FR4material. This arrangement is intended to provide a constant temperaturewhen the ambient temperature is in the range of 15° C. to 35° C.

This approach has several drawbacks. Firstly, the flow of heat throughthe circuit is non-uniform, making steady-state control difficult.Furthermore, each resistor has its own tolerance, making the amount ofheat generated difficult to set. The actuator transistor 570 alsorepresents an extra source of heat, getting hot as a consequence of itsparasitic resistance, the high current running through it and thevoltage between its collector and emitter. These effects create anuneven temperature on the surface of the PCB, and give a longer timeconstant to reach thermal equilibrium. In view of Ohm's law and theformula for electrical power (P=I²R), a small change in current cancause a large change in the power dissipated and consequent heatingeffect. This non-linear relationship makes control even trickier.

The intention of this technique is generally to reduce any influencesthat room temperature changes might have on the output. In somescenarios, controlling the circuit temperature in this way is lesseffective, particularly when high power input signals are provided. Theheat generated by the circuit (self-heating), especially the diode, maytherefore have a significant impact on the performance. The relationshipbetween the current-voltage relationship and temperature may be linear,but is typically non-linear (quadratic or logarithmic). The closeproximity of the components makes the relationship even moreunpredictable. Moreover, the area of the whole circuit is much largerthan the small die size of a component, such as the diode. Hence, thetime to make a temperature change in a component can be magnitudessmaller than the time for the entire circuit board temperature to changeby the same amount. This makes the use of such ambient temperaturecompensation techniques to mitigate the self-heating effect verychallenging.

Providing a circuit, for instance using a rectifying component (such asa diode) and particularly for operation with high input voltages and/orpowers, with a current-voltage characteristic having a reduced(preferably minimal or negligible) temperature dependence and/or astable operation temperature would therefore be highly advantageous.

SUMMARY OF THE INVENTION

Against this background, there is provided a temperature-compensatedelectronic apparatus in line with claim 1, a control circuit as providedby claim 21, an ion optical device as defined in claim 22 and a methodof operating a temperature-controlled electronic apparatus in accordancewith claim 24. Further features of the invention are detailed in thedependent claims.

A temperature-controlled electronic apparatus is formed using electroniccomponents mounted on a circuit board. The temperature control uses: atemperature sensor to measure a temperature of the at least oneelectronic circuit; a temperature control circuit; a heat-generatingcomponent controlled by the temperature control circuit to generate heatin response to the temperature measured by the temperature sensor (andprovide closed-loop control thereby). The electronic components arearranged on the circuit board to lie on one or more paths, each of whichfollows a respective circle having a radius. The one or more paths maybe a plurality of paths. Then, each of the plurality of paths may followa respective concentric circle having a (different) radius. In otherwords, the components are laid out in circles, with increasing distancefrom a (common) center point. This may improve heat distribution.Thermal management may be more accurate and may have a faster responseto thermal changes then existing circuit designs. Preferably, theelectronic components are arranged in a novel, rotationally symmetricway (so that if the circuit board were rotated, the arrangement wouldgenerally look the same).

The electronic apparatus is typically an RF detector, which may formpart of a power supply for an ion optical device, in particular toprovide to provide a potential to an electrode of the ion opticaldevice. The ion optical device may be a quadrupole. An ion opticaldevice and a mass spectrometer comprising such an ion optical device mayalso be considered. Using the approach described herein the electronicapparatus may work in a more precise and stable way, in particular allowa precise and stable potential to be provided to an ion optical device.The RF detector may be improved in terms of accuracy in converting an AC(or RF) to a related DC voltage, for use in a closed-loop high voltageAC/RF generator system, more resilient to room temperature changes andlong term component ageing effects.

Advantageously, the electronic components are arranged such that thosedissipating a higher power in use are on a path having a larger radiusthan that of the electronic components dissipating a lower power in use.In other words, higher power dissipating components are arranged furtherfrom the (common) center. In particular, the electronic componentsseparated from one another such that the ratio of an area surroundingthe electronic component (in which no other electronic components arelocated) to the power that the electronic component dissipates in use,is approximately the same for all the components. Hence, higher powercomponents are arranged further from the center than lower powercomponents.

Some of the electronic components may be duplicated. In other words,instead of a single functional component, multiple functional componentsmay be implemented to provide the same functionality. This may be donein a way in which the total power dissipated by the duplicatedcomponents together is the same as the power dissipated by a singlecomponent achieving the same function, but the temperature increase dueto the duplicated components is lower than would occur for a singlecomponents. The duplicated components may each dissipate the same poweras each other in use and they may be arranged on the same path.

The temperature sensor is preferably located at the (common) centerpoint of the paths. The heat-generating component is beneficiallylocated on the other side of the circuit board to the electroniccomponents (forming the functional circuit). More preferably, theheat-generating component is located at the (common) center point. Inthe preferred embodiment, the heat-generating component is mounted on aheat spreader that extends across the back side of the circuit boardco-extensive with circuit on the front side of the circuit board (thatis, the paths). Advantageously, the heat-generating component comprises(or is) a heating transistor. Cut-outs may be located along a cut-outpath defined by a circle concentric with the one or more paths. Thecut-out path preferably has a radius that is larger than the radius ofany of the one or more paths. Optionally, the heat spreader is arrangedto extend up to the cut-outs. The circuit board beneficially comprisesmultiple metal layers, which may be copper. This may further improveheat spreading and may additionally provide RF shielding.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention may be put into practice in a number of ways, and apreferred embodiment will now be described by way of example only andwith reference to the accompanying drawings, in which:

FIG. 1 shows a known relationship between the current through a diodeand the voltage across the diode and how this varies with respect totemperature;

FIG. 2 depicts a typical existing circuit of a RF detector forconverting an input AC voltage signal to a corresponding DC voltageusing a diode, together with a graph illustrating the relationshipbetween the input voltage and the power dissipated in the diode;

FIG. 3 shows a closed-loop controlled RF potential power supply for anion optical device, using an RF detector;

FIG. 4 illustrates an RF detector in accordance with a first embodimentof the disclosure, using multiple diodes;

FIG. 5 shows plots of diode current against time for two diodes of theembodiment of FIG. 4, together with a plot showing the sum effect of thetwo diode currents against time;

FIG. 6 shows a plot of the total power dissipated by three diodes of theembodiment of FIG. 4 against time;

FIG. 7 illustrates an RF detector in accordance with a second embodimentof the disclosure;

FIG. 8a depicts a first example of RF signal amplitude against time foroperation of the RF detector of FIG. 7;

FIG. 8b depicts a second example of RF signal amplitude against time foroperation of the RF detector of FIG. 7;

FIG. 9 shows a schematic illustration of a known ICP mass spectrometer,with which the invention may be used;

FIG. 10 schematically shows an arrangement of components for an existingambient temperature-compensated RF detector circuit;

FIG. 11 depicts a block diagram of a thermal controller for an RFdetector in accordance with a third embodiment;

FIG. 12 illustrates a layout of components for an RF detector andthermal controller of the third embodiment on a first side of a printedcircuit board;

FIG. 13 shows one principle of operation of the embodiment of FIG. 12;

FIG. 14 depicts another principle of operation of the embodiment of FIG.12; and

FIG. 15 illustrates two views of components on a second side of theprinted circuit board of the embodiment shown in FIG. 12.

DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT

Referring to FIG. 3, there is shown a closed-loop controlled RFpotential power supply for an ion optical device, using an RF detector.This is depicted in a schematic form, as a block diagram. The powersupply comprises: an RF signal generator 100; a closed-loop amplitudecontrol circuit 110; and an ambient temperature compensation part 160.The power supply provides a controlled RF potential 145 as an output.This is provided to an ion optical device, such as a quadrupole massfilter or mass analyser 170.

The RF signal generator 100 generates an RF signal 105, which isprovided as an input to the closed-loop amplitude control circuit 110.The closed-loop amplitude control circuit 110 comprises: a controller120; an RF amplifier 130; a transformer 140; and an RF detector 150. Thecontroller 120, which is typically a proportional-integral-derivative(PID) controller, provides as an output, a controlled RF signal 125 tothe RF amplifier 130. The RF amplifier 130 amplifies the controlled RFsignal 125 and provides an amplified RF signal 135 to the RF transformer140. The secondary side output of the RF transformer 140 provides thecontrolled RF potential 145. The controlled RF potential 145 is alsoprovided as an input to the RF detector 150 via a voltage divider 155.The voltage divider 155 thereby provides a divided controlled RFpotential 156. The RF detector 150 converts the received dividedcontrolled RF potential 156 into a DC level 151, which is indicative ofthe amplitude of the controlled RF potential 145. The input to the RFdetector from the voltage divider 155 is typically around 1 to 20 V at afrequency of around 1 to 10 MHz. The DC level 151 is provided as aninput to the controller 120, together with the RF signal 105 from the RFsignal generator 100, in order to generate the controlled RF signal 125thereby. In order to maintain the ambient temperature of the closed-loopamplitude control circuit 110 at a set level, the ambient temperaturecompensation part 160 measures the ambient temperature and provides heat165 if needed to keep the ambient temperature at a set level.

A number of specific improvements in this power supply will now bedescribed, especially with reference to the RF detector 150 and theambient temperature compensation part 160.

Improved RF Detector Design

The design of the RF detector 150 shown in FIG. 3 has previously been inaccordance with FIG. 2, as discussed above. The RF detector 150 uses atleast one semiconductor diode (comprising a semiconductor junction, inthe form of a PN or Schottky junction) in order to rectify its RF inputand convert to a DC level. An improved design of RF detector comparedwith that shown in FIG. 2 is therefore desirable, in view of thesensitivity to temperature that such diodes can exhibit.

It has been recognised that, keeping the power dissipated or lost in thediode at a fixed (preferably constant) level over time mitigates thenon-linear effects of diode self-heating by avoiding significanttemperature changes in the diode. Thus, the I-V characteristic of thediode becomes temperature independent and any offset caused by the powerloss in the diode no longer depends on the total or average input signalpower.

In general terms, there may therefore be considered atemperature-compensated rectifying component, configured to receive aninput signal. The temperature-compensated rectifying component comprisesa diode part, for rectifying the received input signal and providing arectified output signal thereby. The diode part has an operationaltemperature. The temperature-compensated rectifying componentadvantageously further comprises a temperature compensation controller,configured to control (preferably, directly) a power dissipated by thediode part over a predetermined period of time, such that an average ofthe operational temperature over the predetermined period of time meetspre-set criteria.

A method of manufacturing and/or operating a temperature-compensatedrectifying component, an RF detector, a control circuit for setting anamplitude of an RF potential for supplying to an electronic amplifier inan analytical instrument (such as an ion optical device in a massspectrometer), an ion optical device and/or a mass spectrometer havingone or more functional steps corresponding with functionality of anyspecific apparatus or device herein is also provided. The ion opticaldevice is preferably a quadrupole ion optical device, such as aquadrupole ion trap or quadrupole ion guide.

The diode part is preferably for rectifying an RF input signal. Thediode part is preferably for rectifying an RF input signal, for examplewith a frequency of at least 50 kHz, 100 kHz, 1 MHz, 2 MHz, 5 MHz or 10MHz and/or no more than 5 MHz, 6 MHz, 7 MHz, 8 MHz, 9 MHz or 10 MHz. Therange of frequencies may be between 1 MHz and 10 MHz, 1 MHz and 8 MHz,1.5 MHz to 6 MHz or 3 MHz to 5 MHz, for instance. However, the diodepart may be suitable for rectifying RF input signals up to 1 GHz, insome cases. Typically, the diode part is for rectifying an input signalof as low as 1V, 3V or 5V and/or as high as 7V, 10V, 15V or 20V. Thediode part may be for rectifying an input signal having a power of aslow as 1W, 3W, 5W or 10W and/or as high as 10W, 15W, 20W, 25W or 30W.The diode part beneficially comprises a semiconductor diode, forinstance made from silicon, germanium, SiGe, GaAs, GaN, SiC or acombination of materials. The semiconductor diode may be a PN junctiondiode or a Schottky diode (with a metal-semiconductor interface). ASchottky diode is advantageous in view of a number of factors. Firstly,its switching time from forward to reverse bias (for example around 10ns) is typically much less than for a silicon diode (normally about 100ns). Also, its performance is usually less temperature dependent and itsparasitic capacitance is generally smaller than a PN junction diode.

Preferably, the temperature compensation controller is configured tocontrol a total power dissipated by the diode part over thepredetermined period of time to be a set level. This is particularlysuch that the average of the operational temperature over thepredetermined period of time is (approximately) constant. In thiscontext, the average of the operational temperature over thepredetermined period of time is typically understood as an arithmeticaverage. In particular, the pre-set criteria may be that the powerdissipated by the diode part and/or the average of the operationaltemperature over the predetermined period of time is constant (that is aset value) or does not vary by more than 20%, 15%, 10%, 5%, 2% or 1%from a set value. In another sense, the average of the operationaltemperature over the predetermined period of time may not vary by morethan 1° C., 2° C., 5° C., 10° C. or 15° C. Additionally oralternatively, the temperature compensation controller may be configuredto control the power dissipated by the diode part over the predeterminedperiod of time, such that the power dissipated by the diode part and/orthe average of the operational temperature over the predetermined periodof time does not exceed a first threshold and does not go below a secondthreshold. The first and/or second thresholds may be set with referenceto the maximum variation discussed above. The first threshold isnormally less than 100° C. The predetermined period of time may be 1 s,2 s, 5 s, 10 s, 20 s, 25 s, 30 s, 40 s or 45 s.

In the description herein relating to temperature compensation for acomponent (especially with reference to FIG. 2 above and FIGS. 4 and 7below), the rectifying diode has been shown as a single diode acting torectify the received AC potential. However, a more common implementationwould use at least four diodes in a Graetz bridge rectifierconfiguration. In fact, each of the four diodes could be implemented bytwo or more parallel diodes, to mitigate a high current load for eachdiode. In general terms, the temperature-compensated rectifyingcomponent may form part of a bridge rectifier circuit.

In further general terms and in another aspect, it will be understoodthat an RF detector may be provided. The RF detector is preferably forgenerating a DC level from a RF input signal and may comprise arectification stage, configured to receive the RF input signal andprovide a rectified RF signal thereby. The rectification stageadvantageously comprises at least one temperature-compensated rectifyingcomponent in accordance with this disclosure. The RF detector mayfurther comprise a low pass filter, arranged to provide a signalindicative of the amplitude of the RF input signal as a DC level fromthe rectified RF signal. In particular, the low pass filter isconfigured to suppress unwanted higher harmonic components of therectified input RF signal (in other words, reducing ripple voltage). Inthe preferred embodiment, the at least one temperature-compensatedrectifying component is a plurality of temperature-compensatedrectifying components, for example forming a bridge rectifier.Optionally, the RF detector further comprises an ambient temperaturecompensator, configured to heat the diode part in response to adetermination that the operational temperature of the diode part is lessthan a set temperature.

Two specific implementations to achieve this fixed or constant powerdissipation are presented. Each of these can be considered a specificexample of a broader category of techniques, as will now be discussed.The first of these two approaches is currently preferred.

Secondary-Diode Approach

The basic principle of this approach is that, as well as the diode usedfor rectifying the (RF) input potential (a “first” diode), a seconddiode is provided. The second diode is thermally coupled to the firstdiode, such that the temperatures of the first and second diodes areclosely linked and essentially the same. This may be the case if thefirst and second diodes are provided in the same device package (amulti-device package), for example in the form of an integrated circuit,chip or similar. The power dissipated through the second diode may becontrolled on the basis of the package temperature (which is largely afunction of the power dissipated by the first diode), in order to keepthe total power dissipated by the package, which will be the sum of thepower dissipated through both the first and second diodes, at a constantand/or set level. In so doing, the package temperature and therefore thetemperature of the first diode, is regulated. In principle, multiple“second” diodes could be provided in accordance with this approach,although this would require the power dissipated by each “second” diodeto be controlled based on the first diode.

In general terms, as detailed above, the diode part may be considered tocomprise a first diode, arranged to receive the input signal andconfigured to rectify the input signal, so as to provide the rectifiedoutput signal. Then, the diode part may further comprise at least onefurther diode, thermally coupled to the first diode (such that itstemperature changes in accordance with that of the first diode andpreferably such that the temperatures of the first diode and at leastone further diode are the same). The temperature compensation controlleris advantageously configured to set a power dissipated by the at leastone further diode based on a power dissipated by the first diode andsuch that the total power dissipated by the first diode and the at leastone further diode over the predetermined period of time is a set level.The power dissipated by the at least one further diode may be set basedon or adjusted in an inverse relationship to the operational temperatureof the diode part. In a preferred embodiment, the at least one furtherdiode may comprise a second diode (thermally coupled to the first diode,as discussed above). Then, the temperature compensation controllercomprises a compensation current source, configured to provide acompensation current to the second diode. The compensation current maybe set to control the power dissipated by the at least one furtherdiode, in accordance with the parameters identified herein.

Referring next to FIG. 4, there is illustrated an RF detector 200 inaccordance with this first embodiment, using multiple diodes. This canbe considered a hardware implementation (in contrast with a secondembodiment, discussed below). Where components common with those of theRF detector 1 of FIG. 2 are shown, the same reference numerals have beenused. The RF detector 200 comprises: a diode package 201; a resistor 30;a capacitor 40; and an inductor 50. The diode package 201 comprises: afirst diode 210; a second diode 220; and a third diode 230. The firstdiode 210, second diode 220 and third diode 230 are all in the samepackage (and typically on the same component or die or in the samehousing) and therefore all thermally coupled to one another. The areasize of the component making up the first diode 210, second diode 220and third diode 230 may be around 0.5 mm². Many high frequency diodes onthe market are available not only in a single unit package rather thanin two, triple or quad configuration. The size of the component in whichthe diodes are embedded (for example, the continuous die area coveringall the diodes) is small and consequently, the thermal coupling betweenthe diodes is very good, with a small delay time constant betweentemperature changes.

The purpose of the first diode 210 is to rectify input AC voltage signal10 to provide signal 60, which is then processed by a low pass filter(formed by the resistor 30, capacitor 40 and inductor 50) to provide acorresponding signal indicative of the amplitude of the RF input signalwithout ripple. The second diode 220 is intended to provide additionalpower dissipation to control the temperature, as discussed above. Thepower dissipation of the second diode 220 is controlled by acompensation current (I_(compensation)). The compensation current isgenerated based on the temperature of the diode package 201.

In principle, the package temperature may be determined by a temperaturesensor. This is efficiently effected in this embodiment using the thirddiode 230. A constant current source (CCS) 232 injects a small current,I_(measure), through the third diode 230. The current from the CCS 232is calculated such that no significant self-temperature effects canoccur. Therefore, the voltage drop across the PN-junction of the thirddiode 230 indicates the temperature of the third diode 230 (andtherefore the temperature of the package 201). This therefore sets thepotential at the anode of the third diode 230 with respect to ground,U_(DT). An operational amplifier 234 measures this voltage, which isfurther amplified by amplifier 224 and transistor power amplifier 222 toprovide the compensation current to the second diode 220. The transistorpower amplifier 222 is provided for higher compensation, if theoperational amplifiers 224, 234 cannot deliver enough current, but canbe omitted if not needed. This configuration may effectively form aclosed loop operational circuit, converting an input voltage to anoutput current.

An example operation of this RF detector 200 may be helpful tounderstand the temperature regulation. Firstly, assume a non-zerocurrent is flowing in through the second, compensation diode 220 andthat the temperature of all three diodes (that is, the temperature ofthe package 201) is stable. Then, the amplitude of the RF input signal10 increases, causing a higher current through the first diode 210. Thiscauses the temperature of the first diode 210 to rise. The temperatureof the third diode 230 will also rise, because of the close coupling ofthe diodes (and indeed, the temperature of the second diode 220 and thepackage 201 will also rise). In view of the relationship shown in FIG. 1for the voltage drop based on the temperature (the upper formula), thevoltage drop across the third diode 230 will change to a lower value (−2mV/K). This change in voltage drop will cause U_(DT) to reduce and thiswill be picked up by the operational amplifier 234. As a result, thecompensation current I_(compensation) will also go down, reducing thecurrent through and therefore the power dissipated in the second diode220. By appropriate calibration, the total power dissipated by the firstdiode 210, second diode 220 and third diode 230 therefore remains thesame. The converse situation will be understood when the amplitude ofthe RF input signal 10 decreases, causing the voltage drop across thethird diode 230 to increase and the power dissipated in the second diode220 to increase.

The power dissipated in the second diode 220 D2 is thereby alwaysinversely related to the power dissipated in the first diode 210. Withreference to FIG. 5, there are shown plots of diode current against timefor the first diode 210 (diode current I_(D1)) and the second diode 220(diode current I_(D2)), together with a plot showing the sum effect ofthe two diode currents against time (I_(D1)+I_(D2)). In the left-handplot, the current through the first diode 210 I_(D1) is depicted, withvarying levels. The middle plot shows the current through the seconddiode 220 I_(D2), which will be seen to change inversely with respect tothe current through the first diode 210. The right hand plot shows thesum effect of the two diodes over time, with the total power dissipatedby the two diodes being constant over time and therefore, thetemperature T_(D1+D2) of the two diodes being maintained at a constant,fixed level, even with different load currents through the first diode210.

Referring to FIG. 6, there is shown a plot of the total power dissipatedby the first diode 210 (P_(D1)), the second diode 220 (P_(D2)) and thethird diode 230 (P_(D3)) against time, which can be seen to be constant.The amplifiers 222, 224, 234, the first diode 210, the second diode 220,the third diode 230 and the CCS 232 therefore form a closed-loop circuitthat maintains the power loss and therefore the temperature of thepackage 201 constant, without the previous problems of thermal changesof the characteristics for the rectifying (first) diode 210. Althoughthree diodes are shown in these examples, it will be understood that foreach of the first, second and third diodes may in practice comprisemultiple diodes in series and/or parallel, operating together.Preferably from 2 up to 6 diodes are operated in series for each type ofdiode (that is, for each of the first, second and third diodesrespectively).

One benefit of this implementation is that it is straightforward toimplement at low cost. Moreover, no software changes are required to theway in which the input signal 10 is provided, in particular as part ofthe closed-loop controller of FIG. 3.

In general terms, the temperature-compensated rectifying component mayfurther comprise a temperature sensor, configured to generate a signalindicative of the operational temperature of the diode part. Thecompensation current may then be generated in response to the signalindicative of the operational temperature of the diode part. For this tobe effective, the temperature sensor is advantageously thermally coupledto the first and second diodes. The temperature sensor may be a thirddiode. For example, the at least one further diode may comprise a thirddiode, thermally coupled to the first and second diodes. Then, thetemperature compensation controller may further comprise a constantcurrent source, coupled to draw a constant current through the thirddiode. The potential at an anode of the third diode may thereby indicatethe operational temperature of the diode part. Hence, the compensationcurrent may set based on the potential at the anode of the third diode.The temperature compensation controller optionally comprises anoperational amplifier circuit, configured to set the compensationcurrent based on the potential at the anode of the third diode. Theoperational amplifier may be a transconductance amplifier, for instance.

Diode Current Control by Software

An alternative approach, in accordance with the general conceptidentified above, is to control the power dissipated in the rectifyingdiode, such that the power dissipated in the rectifying diode averages afixed (constant) level within a time period. This is preferablyimplemented in software.

Referring to FIG. 7, there is illustrated an RF detector 300 inaccordance with a second embodiment. Where components common with thoseof the RF detector 1 of FIG. 1 are shown, the same reference numeralshave been used. The RF detector 300 comprises: a software controller310; a diode 20; a resistor 30; a capacitor 40; and an inductor 50. Thediode 20, resistor 30, capacitor 40 and inductor 50 operate in the sameway as described above with respect to FIG. 1. The software controller310 controls the way that signals are applied to the diode 20 forrectification and therefore the power dissipated in the diode 20. Inprinciple, the software controller 310 controls the power dissipated indiode 20 to average (in an arithmetic sense) a fixed and constant levelover time. In other words, the mean power dissipated over time remainsfixed. This is achieved by dissipating additional power in the diodeduring a dummy time period at regular intervals and will now beillustrated using examples.

Referring to FIG. 8a , there is depicted a first example of RF signalamplitude against time for operation of the RF detector of FIG. 7. In afirst time period, an RF signal of a first amplitude is rectified(corresponding with a quadrupole mass filter or mass analyser 170capturing a first mass m₁) and a first power P₁ is dissipated. The powerdissipated is dependent on the mass captured and/or filtering in thedevice 170 (or conversely, each mass of an ion is related tocorresponding RF amplitude). In a second time period, an RF signal of asecond amplitude is rectified (corresponding with a quadrupole massfilter or mass analyser 170 capturing and/or filtering a second mass m₂)and a second power P2 is dissipated accordingly. Likewise, an RF signalof a third amplitude is rectified in a third time period (correspondingwith a quadrupole mass filter or mass analyser 170 capturing and/orfiltering a third mass m₃) and a third power P₃ is dissipated incorrespondence.

Based on P₁, P₂ and P₃, the software controller 310 determines theaverage power dissipation over the combined first, second and third timeperiods. It then determines a duration of an additional time period andan additional power dissipation in order to set the average powerdissipation over the combined first, second, third and additional timeperiods to equal the predetermined constant value desired. In this case,the duration of the additional time period is shown as t_(Dwell1) andthe determined additional power dissipation is shown as P_(Dummy)(effectively, as if an ion of mass m_(Dummy) is filtered by quadrupolemass filter 170). It is noted that the additional amplitude ispreferably significantly higher than the maximum usable RF amplitude, tokeep the dwell time short in comparison to the RF amplitude signals usedfor the analyser.

Referring to FIG. 8b , there is depicted a second example of RF signalamplitude against time for operation of the RF detector of FIG. 7. Thisis similar to the first example in some respects and for convenience,the power dissipations in the first example are also shown by way ofcomparison. In a fourth time period, an RF signal of a fourth amplitudeis rectified (corresponding with a quadrupole mass filter 170 capturingand/or filtering a fourth mass m4) and a fourth power P₄ is dissipated.In a fifth time period, an RF signal of a fifth amplitude is rectified(corresponding with a quadrupole mass filter 170 capturing and/orfiltering a fifth mass m₅) and a fifth power P₅ is dissipated. An RFsignal of a sixth amplitude is rectified in a sixth time period(corresponding with a quadrupole mass filter 170 capturing and/orfiltering a sixth mass ms) and a sixth power P₆ is dissipated. Based onP₄, P₅ and P₆, the software controller 310 determines the average powerdissipation over the combined fourth, fifth and sixth time periods. Itthen determines a duration of a seventh time period and a seventh powerdissipation in order to set the average power dissipation over thecombined fourth, fifth, sixth and seventh time periods to equal thepredetermined constant value desired (which will advantageously be thesame as that used in the first example). In this case, the duration ofthe seventh time period is shown as t_(Dwell2) and the determinedseventh power dissipation is shown as P_(Dummy)* (effectively, as if anion of mass m_(Dummy)* is filtered by quadrupole mass filter 170).

It will be noted that t_(Dwell2) is greater than t_(Dwell1) andP_(Dummy) is equal to P_(Dummy)* (or m_(Dummy) and m_(Dummy)* are thesame). This is because the diode 20 has a maximum power dissipation.Therefore, the software controller 310 may not always be able to controlthe power dissipated in diode 20 to average a fixed level over time onlyby changing the dummy power dissipation. By adjusting the duration ofthe dummy time period and/or the dummy power dissipation, the averagepower dissipation can more efficiently and effectively be controlled. Inpractice, the maximum power dissipation is always used and only theduration of the dummy time period is adjusted, in order to keep theduration of the dummy time period as short as possible.

To summarise the above in a slightly different way, the area enclosedbetween the power dissipation (y-axis) and the time line (x-axis) mayeffectively represent the power loss in the rectifying diode 20. Withthis information and the adjustable dwell time of the dummy power, thearea enclosed by the power dissipation chart over the time may be fixedat a constant level. A constant area means a constant power loss in thediode. In this way, the temperature in the diode is also keep constantand no change of error inducing thermal change can occur.

In general terms, the temperature compensation controller may beconfigured to control the operation of the diode part such that: duringa first portion of the predetermined period of time, the diode partprovides the rectified output signal based on the received input signal;and during a second portion of the predetermined period of time(non-overlapping with the first portion of the predetermined period oftime), the diode part provides the rectified output signal based on acompensation signal. The compensation signal is advantageously set suchthat the power dissipated by the diode part over the predeterminedperiod of time is a set level. Beneficially, the temperaturecompensation controller is configured to set the amplitude of thecompensation signal and/or the duration of the second portion of thepredetermined period of time such that the power dissipated by the diodepart over the predetermined period of time is a set level. Thetemperature compensation controller may be implemented as a computerprogram in this way.

Such implementations may be less preferred to the secondary diodeapproach, discussed above. This is partly because controlling the diodecurrent introduces overheads into the device, due to the additional timeconsumption when the dummy power is being dissipated, making it lessefficient. This may be particularly unfavourable when measuring onlysmall numbers of different masses (say, up to 10). In this case, anadditional dwell time of 5 seconds or more for each run is potentiallyunfavourable. Nonetheless, there may be scenarios where this approach ispreferable to the secondary diode approach. For example, it may be ofbenefit where hardware change in the RF detector is more difficult ornot possible.

Improved Ambient Temperature Compensation

Referring to FIG. 11, there is depicted a block diagram of a thermalcontroller for an RF detector in accordance with a third embodiment. Thethermal controller comprises: a temperature sensor 610; a temperaturecontrol circuit 620; a voltage divider 630; a heating transistor 640;and a constant current source 650. Thermal shielding 660 is ideallyprovided to couple the heating transistor 640 and the temperature sensor610.

The temperature sensor 610 measures the temperature of the circuit andprovides a temperature signal 615 indicative of this measurement to thetemperature control circuit 620. The temperature control circuit 620 isconfigured to generate a control signal 625, which controls theoperation of the heating transistor 640 accordingly. The temperaturecontrol circuit 620 achieves this by comparing the temperature signal615 with a set temperature level 635, which is indicative of a desiredstable operating temperature and is set by the voltage divider 630 andmay therefore be set and/or adjusted by a user, for example duringcalibration or initial set-up. The configuration of the componentsforming this thermal controller and the RF detector circuit (forinstance, as described above with reference to FIG. 4 or 7) may have asignificant effect on its performance.

As discussed above with reference to FIG. 10, existing approaches toimplementing ambient temperature compensation have significantdrawbacks, in particular due to the problems of self-heating, thenon-linear correlation between the current-voltage relationship of thecomponents and temperature, the close proximity of the components andthe long time needed to effect a circuit board temperature change. Inaddition, further problems have been identified: uneven heatdistribution on PCB surface due to poor symmetry in component placement;excessive self-heating of the components caused by high concentration ofelectronic devices; heat conduction being used as the main hear-transfermechanism in view of planar placing of the heating source (or sources)on the PCB surface; and problems in accurate heat measurement because ofdependence on the placement of a sensor. Together, these issues yieldimperfect heat management, preventing a constant temperature andconsequently, a stable RF detector voltage.

It has been recognised that many of these problems stem from a smallnumber of common design considerations. Firstly, the placement of thecomponents is typically determined based on the electrical requirements,not the thermal behaviour of the circuit. Secondly, the use ofmultipoint heating elements (such as multiple resistors) causesdifferent distances from the heat source to each other component.Addressing these design considerations may significantly improve the wayin which the temperature compensation is implemented.

Considering first the placement of the components, it will be noted thatconventional placement of the electrical components has a mirrorsymmetry (as indicated by symmetry line 501 in FIG. 10). However, thissymmetry is not ideal for heat management, ensuring an equal temperatureover the relatively large surface area of the PCB (in comparison withthe surface area of any one component). However, other forms of symmetrymay be more conducive to better thermal management, for examplerotational symmetry. Moreover, further benefits may be gained by usingalternative ways of heating the components to provide temperaturecontrol.

With reference now to FIG. 12, there is illustrated a layout ofcomponents for an RF detector (a high frequency voltage detector) andthermal controller of the third embodiment on a first side of a printedcircuit board. Where the components are the same as shown in FIG. 10,the same reference numerals have been used (and it may be assumed thatthe function of such components in FIG. 12 is the same as for FIG. 10,unless indicated otherwise). It will be seen that, unlike FIG. 10, thearrangement of components in FIG. 12 has a rotational symmetry. Thecomponents are provided along paths defined by concentric circles ofdiffering radii.

At the center of the circuit arrangement is provided the temperaturesensor 700. Immediately surrounding this are provided capacitors 550.Surrounding the capacitors are inductors 540. Then at a wider radius,the diodes 520 are mounted. Load resistors 530 are then provided arounda further circular path. Finally thermal cut-outs 710 are providedsurrounding the entire circuit. These can isolate the detector circuitarea from the rest of the PCB. Connections on the circuit board areprovided by metal tracks, such as tracks 705 passing between twocut-outs 710, which can transport signals (voltages and/or currents)from the outside to the detector circuit and vice versa. The area of thecircuit within the cut-outs is typically at least 2 cm² or 3cm² and maybe as great as 5 cm² or 10 cm². The temperature control circuit may beable to regulate for changes in temperature of at least (or greaterthan) 2° C./hour, 3° C./hour or 4° C./hour. It may be able to regulatefor changes in temperature of up to 4° C./hour, 4.5° C./hour or 5°C./hour. Typically, the

Thus, instead of using a “random” layout for the components (or even onewith simple mirror symmetry), a generally rotationally symmetricplacement (in form of circles or polygons defined by a respectivecircle) is provided. Due the radial placement of the components, allgeneration of heat (either induced or self-generated) will be spreadradially across the circuit on the detector. Local hot spots or areaswith different temperatures are avoided and the path of heat flow iseven to every point in the circle area. Any component in thisarrangement on the PCB thereby has the same temperature. The symmetricarrangement is applied to all components and the PCB itself.

As implied from FIG. 12, the radially symmetric placement of thecomponents can applied to all elements of the circuit (in this case, thedetector). It does not generally matter how the components areelectrically connected to one another. Series and/or parallelconnections can be realised in this matter. For example, it can be seenthat the inductors 540 are connected in series. In contrast, thecapacitors 550 are connected in parallel. Other interconnections can bemade at internal layers of the PCB, but are not shown here.

In general terms of this aspect, there may therefore be considered atemperature-controlled electronic apparatus, comprising: a circuit board(such as a PCB); a plurality of electronic components, mounted on thecircuit board in an arrangement to form at least one electronic circuit;a temperature sensor, configured to measure a temperature of the atleast one electronic circuit; and a heat-generating component,configured to be controlled by a temperature control circuit. Thetemperature control circuit is configured to control an amount of heatgenerated by the heat-generating component in response to thetemperature measured by the temperature sensor. In particular, theplurality of electronic components are arranged on the circuit board tolie on one of a one or more paths, each path being defined by (orfollowing) a respective circle having a radius. The plurality ofelectronic components are typically separate from the temperaturecontrol circuit. The plurality of electronic components generally formone electronic circuit, although there may be one or more furtherelectronic circuits formed by the plurality of electronic components inembodiments.

The one or more paths are preferably a plurality of paths. Then, each ofthe plurality of paths may be defined by or follow a respectiveconcentric circle having a (different) radius. Each path may be definedby a circle and/or by a polygon having corners lying on such a circle.Where the path is defined by a polygon, the components located on thepath are advantageously positioned on the corners of the polygon. Thepolygon is typically regular in such a case.

The temperature sensor, the heat-generating component and thetemperature control circuit are normally configured to provide aclosed-loop temperature control arrangement to maintain the measuredtemperature at a set level. The set level may be fixed, user-determinedand/or typically higher than an ambient temperature (or expected ambienttemperature, for instance in a laboratory). The set level may be set bymeans of a voltage divider, for instance, to provide a signal forcomparison with a signal generated by the temperature sensor. Thetemperature control circuit may be a Proportion-Integral-Derivative(PID) controller, for example. The one or more paths may be a pluralityof paths, in particular understood to define a common center point.Then, the temperature sensor is advantageously located at the commoncenter point. This may provide improved (more accurate) temperaturemeasurement.

Optionally, the temperature-controlled electronic apparatus furthercomprises a plurality of cut-outs located along a cut-out path definedby (or following) a circle concentric with the one or more paths. Thecircle preferably has a radius that is larger than the radius of any ofthe one or more paths. More preferably, the temperature-controlledelectronic apparatus further comprises one or more conductive paths onthe circuit board, in particular metal traces or tracks. These may beconfigured to provide a connection to and/or from the at least oneelectronic circuit, each conductive path running between respectiveadjacent ones of the plurality of cut-outs.

The temperature control circuit is preferably located separately fromthe one or more paths. In other words, it is positioned away from theplurality of electronic components forming the at least one electroniccircuit. In less preferred embodiments, however, the temperature controlcircuit may be formed by a portion of the plurality of electroniccomponents.

In the preferred embodiment, the temperature-controlled electronicapparatus is an RF detector and the plurality of electronic componentsform: a rectification stage, configured to receive an RF input signaland provide a rectified RF signal thereby; and an additional low passfilter, which may be arranged to output a signal of the amplitude of theRF input signal (as a DC level) from the rectified RF signal. The DClevel comprises less ripple (fewer AC components) than the rectified RFsignal. The main component of the DC level may therefore be a DC signal.In some embodiments, the DC level may have some (significantly) smallerAC component. The DC level will change gradually if and when there is achange in the amplitude of the RF input level. The rectification stagetypically comprises at least one diode (and possibly multiple diodes).Preferably, the low pass filter comprises: a capacitor; and an inductor(and optionally a resistor). Optionally multiple capacitors and/orinductors and/or resistors are provided. The RF detector may form partof a control circuit for setting an amplitude of an RF potential forsupplying to an electronic amplifier in an analytical instrument. Inparticular, the analytical instrument may be a mass spectrometer.Advantageously, the control circuit is for setting an amplitude of an RFpotential for supplying to an ion optical device. The control circuitmay in turn form part of a power supply for an ion optical device. Anion optical device comprising such a power supply and/or a massspectrometer comprising such an ion optical device may further beconsidered.

In another aspect, a method of operating such a temperature-controlledelectronic apparatus may be provided. For example, the method maycomprise providing electrical signals to the electronic apparatus so asto operate the at least one electronic circuit, the temperature sensor,the heat-generating component and the temperature control circuit.Providing electrical signals to the electronic apparatus may compriseproviding an input signal (beneficially an AC input signal) to theelectronic circuit. The electronic circuit is preferably a rectifyingcircuit (for converting an AC input signal to a DC output signal). Theeffect of the electronic circuit acting on the input signal is typicallyto generate heat (which may depend on the power of the AC input signal).The method preferably further comprises measuring the temperature of theelectronic circuit using the temperature sensor. Advantageously, themethod further comprises controlling the heat-generating component usingthe temperature control circuit in response to the temperature measuredby the temperature sensor.

Additionally or alternatively, a method of manufacturing atemperature-controlled electronic apparatus as described herein may beconsidered. Any such methods may have one or more functional stepscorresponding with functionality of any specific apparatus or deviceherein is also provided.

This idea, in both its general sense and specific cases, allows thecomponents to be placed in a radial fashion (defined by a radius andangle: r,e), rather than in a conventional “Cartesian” fashion (definedby respective positions on each of two perpendicular axes, such as x,y).Advantageously, this permits the plurality of electronic components tobe positioned on a surface of the circuit board, such that the pluralityof electronic components on the surface generally have rotationalsymmetry. In this way, the heat spread throughout the components may bespread more evenly.

Referring to FIG. 13, there is shown one principle of operation of theembodiment of FIG. 12. To further improve the thermal management, thecomponents are additionally spread out over the PCB. For each functionalcomponent, multiple devices are provided (in series if the device iscontrolled or responsive to current, such as an inductor, or in parallelif it is controlled or responsive to voltage, such as a capacitor orrectifying diode), in order to reduce the temperature of each individualdevice. For example, multiple rectifying diodes may be placed inparallel, to reduce the current flowing through each diode accordingly.The rise in temperature due to the power dissipation is proportional tothe applied power in electronic devices (P_(loss)=T_(rise)). As shown inFIG. 13, a single component consuming (and dissipating) a power P₁ andhaving a temperature T₁ may be replaced by three components eachdissipating a power P₃ and having a temperature T₂. Although the totalpower consumed is the same (3×P₃=P₁), the temperature may be lowered,such that T₂<T₁. Using this technique, the total power consumed by thecomponents is less densely concentrated on the PCB and theself-generated heat is shared between components. By dispersing thepower dissipated per unit area, the thermal management is improved.

In a general sense it may be understood that a portion of the pluralityof electronic components forming the at least one electronic circuitcomprise at least one set (and preferably multiple sets) of duplicatedelectronic components, the electronic components in each set ofduplicated electronic components being configured to have the samefunction and dissipate the same power in use. The components in each setof duplicated components are typically mounted on the same path of thecircuit board.

The placement of the electronic components on the circuit board is notedabove as having a rotational symmetry. As explained there, this allowsbetter heat dissipation. Further improvements to the positioning of thecomponents can be made, though. Referring now to FIG. 14, there isdepicted another principle of operation of the embodiment of FIG. 12.The electronic components are placed in order to keep a ratio of thepower dissipated to the area covered by the component or assigned to thecomponent as fixed or constant. Thus, a more power consuming (and hencedissipating) device, dissipating power P₁ is assigned a larger surfacearea A₁ than a less power consuming (and hence dissipating) device,dissipating power P₂, assigned a smaller surface area A₂. This isachieved in the layout of FIG. 12, by placing the less power dissipatingdevice on a path having a smaller radius than the path on which the morepower dissipating device is placed. Thus, an even lower dissipatingdevice (dissipating power P₃) is assigned an even smaller surface areaA₃. In this way, the power dissipated per unit area may be keptconstant, thereby keeping the temperature due to self-generated heatconstant across the circuit and mitigating thermal influences betweenone component to another.

From the general sense discussed above, it will be noted that each ofthe plurality of electronic components is configured to dissipate arespective power in use. Then, each electronic component may arranged ona path in accordance with its respective dissipated power in use.Additionally or alternatively, the plurality of electronic componentsmay be arranged such that electronic components configured to dissipatea higher power in use are arranged on a path having a larger radius thana radius of a path on which electronic components configured todissipate a lower power in use are arranged. In particular embodiments,the plurality of electronic components may be arranged such thatelectronic components configured to dissipate the same power in use arearranged on the same path.

Beneficially, if a first electronic component is arranged on a firstpath having a first radius and a second electronic component is arrangedon a second path adjacent to the first path (the second path having asecond radius greater than the first radius), the distance between thefirst radius and second radius is based on the power that the secondcomponent is configured to dissipate in use.

In another sense, the plurality of electronic components may be arrangedon the circuit board along the one or more paths and separated from oneanother such that, for each of the plurality of electronic components,the ratio of an area surrounding the respective electronic components inwhich no other electronic components are located to the power that therespective electronic component is configured to dissipate in use, isapproximately the same (across all of the at least one electroniccircuit or at least one of a plurality of electronic circuits). Theratio may be approximately the same if the variation between the ratiofor one component varies from the ratio of another component by no more(or less) than 10%, 5%, 2%, 1% or 0.5% and/or if the ratios differ by nomore (or less) than 0.1, 0.05, 0.01 or 0.005.

Referring next to FIG. 15, there are illustrated two views of componentson a second side of the printed circuit board (opposite the side shownin FIG. 12) of the embodiment shown in FIG. 12. A top view (a) and aside view (b) are shown. The thermal cut-outs 710 that were visible inFIG. 12 can also be seen in the top view (a). The heat generating deviceis a transistor 730 mounted on a heat spreader 740. The transistor 710is connected to the circuit at connections 720, which are also visiblein FIG. 12 on the other side of the PCB. Although one heating transistor730 is shown, multiple heating transistors could be used instead. Theuse of a single active component (in this case a transistor) as a heatgenerator is particularly beneficial, as it combines the advantage of alinear relationship between current or voltage and power dissipated inthe device with the possibility to place the heat source in asymmetrical way to the circuit. The linear power relationship of thetransistor contrasts with the quadratic expression for power dissipated(and hence its heating effect) to voltage or current in a resistor, asdiscussed above.

The heat spreader 740 is advantageously made of metal and extends acrossthe back side of the PCB up to the thermal cut-outs 710 and thereforeover the whole surface area behind the circuit on the other side. Theheat spreader 740 spreads the heat across the surface area of the PCB tokeep the temperature stable and reduce the time taken for temperatureequilibrium to be achieved once heat is generated. In addition, themultiple planes of copper are beneficially provided in the inner layersof the PCB. This may improve heat spreading and also acts as an RFshielding. Through the use of metal (instead of PCB FR4 material), withits greater thermal conductivity, the time constant of heat equalisingprocesses is greatly reduced. One particular advantage of the heatspreader is to shield the voltage divider 630 and thereby keep a stablereference level for the temperature control.

In a preferred embodiment of the general sense discussed above, theplurality of electronic components are located on a first side of thecircuit board and the heat-generating component is located on a secondside of the circuit board (the second side being opposite the firstside). It may be understood that the one or more paths define a centerpoint (or a common center point if there are a plurality of paths) andthen, the heat-generating component is advantageously located at thecenter point or with its center generally at or close to the centerpoint (for example, no further away than the closest of the one or morepaths to the center point).

Preferably, the heat-generating component is mounted on a heat spreader.Advantageously, the heat spreader is arranged to extend across thesecond side of the circuit board co-extensive with the one or more pathsdefined on the first side of the circuit board. More preferably, theheat spreader is arranged to extend up to the cut-outs.

Beneficially, the heat-generating component comprises a heatingtransistor. This may provide significant benefits over one or moreheating resistors, due to the non-linear voltage-current relationshipfor the transistor in comparison with the linear voltage-currentrelationship for a resistor.

In the preferred embodiment, the circuit board comprises multiple(preferably planar) metal layers. These may provide heat spreading andRF shielding effects. They may also provide circuit interconnections.The metal layers advantageously comprise (and more preferably are or areformed of) copper.

Key advantages of the technique described here include: the use ofsingle heating device with equal distances to the point of use; a costsaving, as no heating resistors are required; no linear relationship inthe transistor between collector current and collector-emitter voltage;the closed-loop operation circuit uses a linear relationship between thevoltage applied to the transistor and the dissipated power, so that thesupplied power can be better controlled; high symmetry for all componentyields an even heat distribution on the PCB surface; self-heating isdecreased (to a minimum) due to the load-sharing effect of multipleelectrical components; equal temperatures are achievable due to constantarea to dissipated power ratios; a fast thermal time constant isachieved due to the use of metal for heat transport; and heatconduction, convection and radiation is used as main transferringmechanism, due to the heat establishment on the top and bottom of thecircuit.

In particular, it should be noted that the temperature control may fixthe circuit temperature to between 40° C. and 75° C., preferably between55° C. and 65° C. and more preferably between 58° C. and 60° C.Moreover, the number of devices used in the arrangement of FIG. 12 is infact lower than that of FIG. 10. For example, the number of loadresistors 530 are reduced from 36 in the embodiment of FIGS. 10 to 18 inthe FIG. 12 embodiment.

Ion Optical Device Implementation

In another generalised aspect, there may be considered a control circuitfor setting an amplitude of an RF potential for supplying to anelectronic amplifier in an analytical instrument (such as a massspectrometer). The control circuit may particularly be for setting anamplitude of an RF potential for supplying to an ion optical device. Thecontrol circuit beneficially comprises: a controller, configured toreceive an RF signal from an RF generator, to receive a signal (DClevel) indicative of the amplitude of the RF potential and to generatean RF output from the received RF signal, adjusted on the basis of thereceived signal indicative of the amplitude of the RF potential; anoutput circuit, arranged to generate the RF potential for supplying toan ion optical device from the RF output of the controller; and an RFdetector as herein described, configured to receive the RF potential andto generate the signal indicative of the amplitude of the RF potentialfor the controller. Optionally, the output circuit comprises an RFamplifier, arranged to receive the RF output from the controller and toamplify the RF output. Then, the output circuit may further comprise atransformer, configured to receive the amplified RF output as aprimary-side input and to provide the RF potential as a secondary-sideoutput. Optionally, the output circuit may also comprise a voltagedivider, configured to couple the RF potential from the secondary sideof the transformer to the RF detector.

There may also be provided a power supply for an ion optical device,comprising: an RF generator, configured to generate an RF signal; and acontrol circuit as herein disclosed, configured to receive the RF signalfrom the RF generator and provide the RF potential to the ion opticaldevice. In yet another aspect, there may be considered an ion opticaldevice, comprising: an electrode arrangement for generating an RFelectrical field using a received RF potential; an RF generator,configured to generate an RF signal; and a control circuit as describedherein, configured to receive the RF signal from the RF generator andprovide the RF potential to the electrode arrangement.

It has been shown in FIG. 3 (described above), how to implement an RFpotential power supply for an ion optical device, using an RF detector.More details about the ion optical device and its use will now beconsidered. In particular, the ion optical device is preferably aquadrupole ion optical device, such as a quadrupole ion trap, quadrupolemass filter or quadrupole mass analyser, typically forming part of amass spectrometer.

In a preferred embodiment, the ion optical device forms part of a massspectrometer with an inductively coupled plasma (ICP) ion source, inparticular for elemental analysis. In particular, the mass spectrometermay have two or more analysers for the investigated ions. The firstanalyser is a collision/reaction cell (QCell), for example having a flatquadrupole electrodes (a “flatapole”). The second analyser is aquadrupole ion optical device for the isolation of the ions to bemeasured. An improvement on such a mass spectrometer with two analysershas an additional mass analyser, normally a further quadrupole ionoptical device, which therefore provides a triple-quadrupole massspectrometer. The additional quadrupole is positioned upstream of thecollision/reaction cell. Such a mass spectrometer is disclosed in ourco-pending UK patent application no. 1516508.7 and details of this willnow be briefly discussed for the sake of completeness.

With reference to FIG. 9, there is shown a schematic illustration of aknown ICP mass spectrometer, with which an ion optical device as hereindisclosed may be used. This ICP mass spectrometer comprises: an ICPtorch 410; a sampler cone 420; a skimmer cone 430; ion optics 440; afirst (Q1) mass filter 450; a reaction cell (Q2) 460; a differentiallypumped aperture 470; a second (Q3) mass filter 480; and an ion detector490. The Q3 mass filter 480 may be considered a mass analyser or a partof a mass analyser. In this design, ions are produced in the ICP torch410, introduced into vacuum via sampler 420 and skimmer 430, transportedthrough (bending) ion optics 440 and selected by Q1 quadrupole massfilter 450. It will be noted that Q1 mass filter 450 is relatively shortin comparison with Q2 reaction cell 460 and Q3 mass filter 480, and isschematically depicted so. Moreover, the vacuum conditions of the Q1mass filter 450 are less demanding than for the subsequent stages. Here,the ion optics 440 and Q1 mass filter 450 are operated at substantiallythe same pressure. Ions of the selected mass range pass into thequadrupole reaction cell 460 and the reaction product is directedthrough ion optics and differentially pumped aperture 470 into theanalytical quadrupole mass filter Q3 480 and detected by high dynamicrange detector 490, for example an SEM. The Q3 mass filter 480 is highlyselective (especially in comparison with the Q1 mass filter 450), andhas a band-pass width of typically no greater than 1 amu.

The Q1 quadrupole mass filter 450 selects a limited set of ions to beinvestigated. The Q1 mass filter 450 advantageously has a lowerresolution than the Q3 mass filter 480. As noted above, the Q1 massfilter 450 is a short quadrupole having typically a length of theelectrode in axial direction of the quadrupole of 5 to 7 cm. Thisquadrupole is advantageously less expensive to manufacture than the Q2cell 460 and Q3 mass filter 480. However, it has a much wider band-pathwidth than the Q3 mass filter 480, downstream the Q2 collision/reactioncell 460.

Ions having a mass-to-charge ratio A within a range of interest arepreferably positioned in the flank of the band-path of the Q1 massfilter 450, to avoid significant interference. Downstream the Q2reaction/collision cell 460, the ions of interest detected by the Q3mass filter 480 have a mass-to-charge ratio of A+R. If the interferencelevel detected by the high resolution Q3 mass filter 480 is still high,a shift of the isolation window of the Q1 mass filter 450 isimplemented, to improve the measurement results. Due to the positioningof the mass of interest A in the flank of the band-path of the Q1 massfilter 450 and the issue that incorrect adjustment of the isolationwindow of the quadrupole 450 problem results in increased interference,the voltage supply to the electrodes of Q1 mass filter can have asignificant effect on the performance of the mass spectrometer.Therefore, any external influence on the electronics providing thevoltage for the electrodes, such as temperature changes, are desirablyminimised. The use of a power supply for providing the RF potential tothe Q1 mass filter 450 in such a mass spectrometer may therefore behighly advantageous. The use of such a power supply for providing the RFpotential to the Q3 mass filter 480 is also of potential benefit.

This challenge is made more difficult by the normal measuring mode ofthis mass spectrometer, which unlike other types of mass spectrometer,does not measure a full range of masses. Instead, it is configured tomeasure only specific masses that are to be analysed. Typically, ICPmass spectrometers are used for routine measurements, for example totest the purity of water. These routine measurements have to be quicklycarried out. Typically, 10 sweeps of 4 seconds are performed using themass spectrometer, for each investigated mass, leading to a measurementtime of from 10 to 20 seconds up to 1.5 minutes. Up to 30 differentmasses may be analysed for each investigated sample.

As a result of such operating modes, the supplied RF voltage or voltages(particularly to the Q1 mass filter 450 and the Q3 mass filter 480) maychange very fast. The temperature caused by the applied RF voltage maythen also change quickly, such that conventional temperaturecompensation may be not fast enough. Other types of mass spectrometermeasuring only specific masses (rather than a full range of masses) mayalso face a similar challenge. The average power dissipation in the RFdetector (particularly due to the rectifying diode) and consequenttemperature increase will generally depend on the mass of the ions beinganalysed. A lower mass ion (such as Lithium, Li) will cause a lowerpower dissipation than a higher mass ion (for example, Cobalt, Co). Inparticular, a very high mass ion, such as Uranium (U) will have a muchhigher power dissipation than a lower mass ion, such as Copper (Cu). TheQ1 mass filter 450 will typically be required to handle ions of massesbetween that of Magnesium (Mg) and Gold (Au), whereas the Q3 mass filter480 will typically be required to handle a wider range of masses, forinstance ions of masses between that of Lithium (Li) and Uranium (U). Aseach mass filter analyses ions of different mass, the temperature of theRF detector increases with higher mass and decreases with lower mass.The temperature increase when analysing U immediately after analysing Licould be as high as 60° C. and this could increase could occur within100 μs.

A mass spectrometer comprising an ion optical device as herein disclosedshould therefore be considered in a generalised sense. The massspectrometer may have one or more of: an ICP source; a triple-quadrupoleconfiguration; a configuration for elemental analysis; a controller formeasurements of a single nominal mass-to-charge ratio; and aconfiguration to carry out a measurement in no more than 1.5 minutes, 1minute, 45 seconds, 30 seconds, 20 seconds, 15 seconds, 10 seconds, 5seconds, 4 seconds 2 seconds, 1 second, 0.5 seconds, 0.1 seconds, 0.05seconds, 0.01 seconds, 0.005 seconds or 0.001 seconds. A typical timeduration for an average mass measurement is between 1 ms and 5 s.

Any of the general approaches disclosed herein can be implemented as acomputer program or programmable or programed logic, configured toperform any method described herein when operated by a processor. Thecomputer program may be stored on a computer readable medium.

Any controller herein described may be configured to operate inaccordance with any method steps (alone or in combination) describedherein. It may have structural features (one or more of: one or moreinputs; one or more outputs; one or more processors; logic; andcircuitry) configured to perform any one or more of these method steps.Such a controller may comprise a computer or processor for executing acomputer program or programmable or programmed logic configured toperform any of the methods described herein.

It will be appreciated that variations to the foregoing embodiments canbe made while still falling within the scope of the invention. Althoughthe invention has been described with reference to a particular type ofcircuit and application (an RF detector circuit for an ion opticaldevice) and the invention has particular advantages in such case, asdiscussed herein, the invention may be applied to other types of circuitand/or application. Each feature disclosed in this specification, unlessstated otherwise, may be replaced by alternative features serving thesame, equivalent or similar purpose. Thus, unless stated otherwise, eachfeature disclosed is one example only of a generic series of equivalentor similar features.

As used herein, including in the claims, unless the context indicatesotherwise, singular forms of the terms herein are to be construed asincluding the plural form and vice versa. For instance, unless thecontext indicates otherwise, a singular reference herein including inthe claims, such as “a” or “an” (such as an analogue to digitalconvertor) means “one or more” (for instance, one or more analogue todigital convertor). Throughout the description and claims of thisdisclosure, the words “comprise”, “including”, “having” and “contain”and variations of the words, for example “comprising” and “comprises” orsimilar, mean “including but not limited to”, and are not intended to(and do not) exclude other components.

The use of any and all examples, or exemplary language (“for instance”,“such as”, “for example” and like language) provided herein, is intendedmerely to better illustrate the invention and does not indicate alimitation on the scope of the invention unless otherwise claimed. Nolanguage in the specification should be construed as indicating anynon-claimed element as essential to the practice of the invention.

Any steps described in this specification may be performed in any orderor simultaneously unless stated or the context requires otherwise.

All of the aspects and/or features disclosed in this specification maybe combined in any combination, except combinations where at least someof such features and/or steps are mutually exclusive. As describedherein, there may be particular combinations of aspects that are offurther benefit, such as the use of combined temperature-compensatedcomponents in a temperature-compensated circuit. In particular, thepreferred features of the invention are applicable to all aspects of theinvention and may be used in any combination. Likewise, featuresdescribed in non-essential combinations may be used separately (not incombination).

1. A temperature-controlled electronic apparatus, comprising: a circuitboard; a plurality of electronic components, mounted on the circuitboard in an arrangement to form at least one electronic circuit; atemperature sensor, configured to measure a temperature of the at leastone electronic circuit; and a heat-generating component, configured tobe controlled by a temperature control circuit, the temperature controlcircuit being configured to control an amount of heat generated by theheat-generating component in response to the temperature measured by thetemperature sensor; and wherein the plurality of electronic componentsare arranged on the circuit board to lie on one of one or more paths,each path of the one or more paths being defined by a respective circlehaving a radius.
 2. The temperature-controlled electronic apparatus ofclaim 1, wherein the one or more paths are a plurality of paths, eachpath of plurality of paths being defined by a respective concentriccircle having a different radius.
 3. The temperature-controlledelectronic apparatus of claim 1, wherein the plurality of electroniccomponents are positioned on a surface of the circuit board, such thatthe plurality of electronic components on the surface generally haverotational symmetry.
 4. The temperature-controlled electronic apparatusof claim 1, wherein each of the plurality of electronic components areconfigured to dissipate a respective power in use and the plurality ofelectronic components are arranged such that electronic componentsconfigured to dissipate a higher power in use are arranged on a pathhaving a larger radius than a radius of a path on which electroniccomponents configured to dissipate a lower power in use are arranged. 5.The temperature-controlled electronic apparatus of claim 4, wherein afirst electronic component is arranged on a first path having a firstradius and a second electronic component is arranged on a second pathadjacent to the first path, the second path having a second radiusgreater than the first radius, the distance between the first radius andsecond radius being based on the power that the second component isconfigured to dissipate in use.
 6. The temperature-controlled electronicapparatus of claim 1, wherein the plurality of electronic components arearranged on the circuit board along the one or more paths and separatedfrom one another such that, for each of the plurality of electroniccomponents, the ratio of an area surrounding the respective electroniccomponents in which no other electronic components are located to thepower that the respective electronic component is configured todissipate in use, is approximately the same.
 7. Thetemperature-controlled electronic apparatus of claim 1, wherein thetemperature sensor, the heat-generating component and the temperaturecontrol circuit are configured to provide a closed-loop temperaturecontrol arrangement to maintain the measured temperature at a set level.8. The temperature-controlled electronic apparatus of claim 1, whereinthe one or more paths define a common center point, the temperaturesensor being located at the common center point.
 9. Thetemperature-controlled electronic apparatus of claim 1, wherein theplurality of electronic components are located on a first side of thecircuit board and the heat-generating component is located on a secondside of the circuit board.
 10. The temperature-controlled electronicapparatus of claim 1, wherein the one or more paths define a centerpoint, the heat-generating component being located at the center point.11. The temperature-controlled electronic apparatus of claim 9, whereinthe heat-generating component is mounted on a heat spreader, the heatspreader being arranged to extend across the second side of the circuitboard co-extensive with the one or more paths defined on the first sideof the circuit board.
 12. The temperature-controlled electronicapparatus of claim 1, wherein the heat-generating component comprises aheating transistor.
 13. The temperature-controlled electronic apparatusof claim 1, further comprising: a plurality of cut-outs located along acut-out path defined by a circle concentric with the one or more pathsand having a radius that is larger than the radius of any of the one ormore paths.
 14. The method of claim 13, wherein the heat-generatingcomponent is mounted on a heat spreader, the heat spreader beingarranged to extend across a second side of the circuit boardco-extensive with the one or more paths defined on a first side of thecircuit board on which the plurality of electronic components arelocated, and wherein the heat spreader is arranged to extend up to thecut-out path.
 15. The temperature-controlled electronic apparatus ofclaim 13, further comprising: a conductive path on the circuit board,configured to provide a connection to and/or from the at least oneelectronic circuit, the conductive path running between adjacent ones ofthe plurality of cut-outs.
 16. The temperature-controlled electronicapparatus of claim 1, wherein the circuit board comprises multiple metallayers.
 17. The temperature-controlled electronic apparatus of claim 16,wherein the metal layers comprise copper.
 18. The temperature-controlledelectronic apparatus of claim 1, wherein a portion of the plurality ofelectronic components forming the at least one electronic circuitcomprise at least one set of duplicated electronic components, theelectronic components in each set of duplicated electronic componentsbeing configured to have the same function and dissipate the same powerin use.
 19. The temperature-controlled electronic apparatus of claim 1,wherein the temperature-controlled electronic apparatus is an RFdetector, the plurality of electronic components forming: arectification stage, configured to receive an RF input signal andprovide a rectified RF signal thereby; and a low pass filter, arrangedto generate a signal indicative of the amplitude of the RF input signalfrom the rectified RF signal.
 20. The temperature-controlled electronicapparatus of claim 1, wherein the temperature control circuit is locatedseparately from the one or more paths.
 21. A method of operating atemperature-controlled electronic apparatus, wherein thetemperature-controlled electronic apparatus comprise: a circuit board; aplurality of electronic components, mounted on the circuit board in anarrangement to form at least one electronic circuit; a temperaturesensor, configured to measure a temperature of the at least oneelectronic circuit; and a heat-generating component, configured to becontrolled by a temperature control circuit, the temperature controlcircuit being configured to control an amount of heat generated by theheat-generating component in response to the temperature measured by thetemperature sensor; and wherein the plurality of electronic componentsare arranged on the circuit board to lie on one of one or more paths,each path of the one or more paths being defined by a respective circlehaving a radius; the method comprising providing electrical signals tothe electronic apparatus so as to operate the at least one electroniccircuit, the temperature sensor, the heat-generating component and thetemperature control circuit.
 22. The method of claim 21, wherein thestep of providing electrical signals to the electronic apparatuscomprises providing an input signal to the electronic circuit.
 23. Themethod of claim 21, further comprising: measuring the temperature of theelectronic circuit using the temperature sensor; and controlling theheat-generating component using the temperature control circuit inresponse to the temperature measured by the temperature sensor.